Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL SEMICONDUCTOR PACKAGING INDUSTRY
2.1 Summary about Semiconductor Packaging Industry
2.2 Semiconductor Packaging Market Trends
2.2.1 Semiconductor Packaging Production & Consumption Trends
2.2.2 Semiconductor Packaging Demand Structure Trends
2.3 Semiconductor Packaging Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 DIP
4.2.2 QFP
4.2.3 SiP
4.2.4 BGA
4.2.5 CSP
4.2.6 Others
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 Analog & Mixed Signal
4.3.2 Wireless Connectivity
4.3.3 Optoelectronic
4.3.4 MEMS & Sensor
4.3.5 Misc Logic and Memory
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 DIP
5.2.2 QFP
5.2.3 SiP
5.2.4 BGA
5.2.5 CSP
5.2.6 Others
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 Analog & Mixed Signal
5.3.2 Wireless Connectivity
5.3.3 Optoelectronic
5.3.4 MEMS & Sensor
5.3.5 Misc Logic and Memory
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 DIP
6.2.2 QFP
6.2.3 SiP
6.2.4 BGA
6.2.5 CSP
6.2.6 Others
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 Analog & Mixed Signal
6.3.2 Wireless Connectivity
6.3.3 Optoelectronic
6.3.4 MEMS & Sensor
6.3.5 Misc Logic and Memory
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 DIP
7.2.2 QFP
7.2.3 SiP
7.2.4 BGA
7.2.5 CSP
7.2.6 Others
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 Analog & Mixed Signal
7.3.2 Wireless Connectivity
7.3.3 Optoelectronic
7.3.4 MEMS & Sensor
7.3.5 Misc Logic and Memory
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 DIP
8.2.2 QFP
8.2.3 SiP
8.2.4 BGA
8.2.5 CSP
8.2.6 Others
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 Analog & Mixed Signal
8.3.2 Wireless Connectivity
8.3.3 Optoelectronic
8.3.4 MEMS & Sensor
8.3.5 Misc Logic and Memory
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 DIP
9.2.2 QFP
9.2.3 SiP
9.2.4 BGA
9.2.5 CSP
9.2.6 Others
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 Analog & Mixed Signal
9.3.2 Wireless Connectivity
9.3.3 Optoelectronic
9.3.4 MEMS & Sensor
9.3.5 Misc Logic and Memory
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 ASE
10.1.2 Amkor
10.1.3 SPIL
10.1.4 Stats Chippac
10.1.5 PTI
10.1.6 JCET
10.1.7 J-Devices
10.1.8 UTAC
10.1.9 Chipmos
10.1.10 Chipbond
10.1.11 STS
10.1.12 Huatian
10.1.13 NFM
10.1.14 Carsem
10.1.15 Walton
10.1.16 Unisem
10.1.17 OSE
10.1.18 AOI
10.1.19 Formosa
10.1.20 NEPES.
10.2 Semiconductor Packaging Sales Date of Major Players (2017-2020e)
10.2.1 ASE
10.2.2 Amkor
10.2.3 SPIL
10.2.4 Stats Chippac
10.2.5 PTI
10.2.6 JCET
10.2.7 J-Devices
10.2.8 UTAC
10.2.9 Chipmos
10.2.10 Chipbond
10.2.11 STS
10.2.12 Huatian
10.2.13 NFM
10.2.14 Carsem
10.2.15 Walton
10.2.16 Unisem
10.2.17 OSE
10.2.18 AOI
10.2.19 Formosa
10.2.20 NEPES.
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT

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