NA Probe Card Market - Industry Trends And Forecast To 2029
- Published Date: 2022-12-31
- Report ID: 143931
- Pages: 225
-
Format:
Short Description
North America Probe Card Market, By Probe Type (Advanced Probe Card, and Standard Probe Card), Manufacturing Technology Type (MEMS, Vertical, Cantilever, Epoxy, Blade, Others), Wafer Size (More Than 12 Inches, and Less Than 12 Inches), Head Size (More Than 40mm x 40mm, and Less Than 40mm x 40mm), Test (DC Test, Functional Test, and AC Test), Material (Tungsten, Copper Clad Laminated (CCL), Aluminum, Others), Application (WLCSP, SIP, Mixed Signal Flip Chip, Analog), Beam Size (More Than 1.5 Mil, Less Than 1.5 Mil), End-Use (Foundry, Parametric, Logic and Memory Device, DRAM, CMOS Image Sensor (CIS), Flash, Others), Country (U.S., Canada, and Mexico) Industry Trends and Forecast to 2029
Market Definition:
A probe card is an interface is used to perform a wafer test for a semiconductor wafer. This process is used to check the quality of integrated circuits or latent semantic indexing in the first process of semiconductor manufacturing. Generally, the probe card is electrically connected to a tester and mechanically docked to a prober. The main function of a probe card is to provide an electrical path between the test system and the circuits on the wafer, where the circuits can be tested. The main parts included in probe cards are called printed circuit boards (PCB) and some forms of contact elements. Many items are considered in a probe card, some being very common to use, and some having very special uses.
Market Segmentation:
The North America probe card market is segmented into nine notable segments based on probe type, manufacturing technology type, wafer size, head size, test, material, application, beam size, and end use.
On the basis of probe type, the North America probe card market is segmented into advanced probe card, and standard probe card
On the basis of manufacturing technology type, the North America probe card market is segmented into MEMS, vertical, cantilever, epoxy, blade, others
On the basis of wafer size, the North America probe card market is segmented into more than 12 inches, and less than 12 inches
On the basis of head size, the North America probe card market is segmented into more than 40mm x 40mm, and less than 40mm x 40mm
On the basis of test, the North America probe card market is segmented into DC Test, functional test, and AC test
On the basis of material, the North America probe card market is segmented tungsten, Copper Clad Laminated (CCL), aluminum, others
On the basis of application, the North America probe card market is segmented into WLCSP, SIP, mixed signal flip chip, and analog
On the basis of beam size, the North America probe card market is segmented into more than 1.5 mil, less than 1.5 mil
On the basis of end-use, the North America probe card market is segmented into foundry, parametric, logic and memory device, DRAM, CMOS image sensor (CIS), flash, others
Market Players
Some of the key market players for the North America probe card market are listed below:
FormFactor
FEINMETALL GmbH
RIKA DENSHI CO., LTD.
TSE co,. Ltd.
dynamic-test
STAr Technologies Inc.
MICRONICS JAPAN CO., LTD.
Translarity
SV Probe
MPI Corporation
Onto Innovation
JAPAN ELECTRONIC MATERIALS CORPORATION
WinWay Tech. Co., Ltd.
Wentworth Labs
htt high tech grade GmbH
Technoprobe S.p.A.
TABLE OF CONTENTS
1 INTRODUCTION 36
1.1 OBJECTIVES OF THE STUDY 36
1.2 MARKET DEFINITION 36
1.3 OVERVIEW OF NORTH AMERICA PROBE CARD MARKET 36
1.4 CURRENCY AND PRICING 38
1.5 LIMITATIONS 38
1.6 MARKETS COVERED 39
2 MARKET SEGMENTATION 42
2.1 MARKETS COVERED 42
2.2 GEOGRAPHICAL SCOPE 43
2.3 YEARS CONSIDERED FOR THE STUDY 44
2.4 DBMR TRIPOD DATA VALIDATION MODEL 45
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 48
2.6 DBMR MARKET POSITION GRID 49
2.7 VENDOR SHARE ANALYSIS 50
2.8 MULTIVARIATE MODELING 51
2.9 PROBE TYPE TIMELINE CURVE 51
2.10 MARKET APPLICATION COVERAGE GRID 52
2.11 THE MARKET CHALLENGE MATRIX 53
2.12 SECONDARY SOURCES 54
2.13 ASSUMPTIONS 54
3 EXECUTIVE SUMMARY 55
4 PREMIUM INSIGHTS 58
4.1 SUPPLY CHAIN 60
4.1.1 MANUFACTURERS 60
4.1.2 CONSUMPTION 60
5 MARKET OVERVIEW 61
5.1 DRIVERS 63
5.1.1 INCREASING USE OF INTEGRATED CIRCUITS IN ELECTRONIC DEVICES 63
5.1.2 SURGE IN DEMAND FOR ELECTRONIC TESTING IN THE SEMICONDUCTOR INDUSTRY 63
5.1.3 GROWING INVESTMENT IN MINIATURIZATION OF ELECTRONIC COMPONENT 64
5.1.4 RISING DEMAND FOR SEMICONDUCTORS PROBE CARDS IN AUTOMOBILE INDUSTRY 64
5.2 RESTRAINTS 65
5.2.1 HIGH COST ASSOCIATED WITH PROBE CARD SOLUTION 65
5.2.2 IMPACT OF METAL PRICES ON OVERALL COMPONENT PRODUCTION COST 65
5.3 OPPORTUNITIES 66
5.3.1 RISE IN STRATEGIC PARTNERSHIP AND COLLABORATION 66
5.3.2 RISING ADOPTION OF PROBE CARDS SOLUTION IN AUTOMOTIVE INDUSTRY 66
5.3.3 INCREASING USE OF SEMICONDUCTORS IN MILITARY AND DEFENSE SECTOR 66
5.4 CHALLENGES 67
5.4.1 LACK OF AWARENESS AMONG CONSUMERS REGARDING BENEFITS OF PROBE CARD SOLUTION 67
5.4.2 DISRUPTION IN SUPPLY OF PROBE CARD 67
5.4.3 TECHNOLOGICAL ACCELERATION CREATES A CHALLENGING ENVIRONMENT FOR PROBE CARD SOLUTION 68
6 IMPACT ANALYSIS OF COVID-19 ON NORTH AMERICA PROBE CARD MARKET 69
6.1 ANALYSIS ON IMPACT OF COVID-19 ON THE MARKET 69
6.2 STRATEGIC DECISIONS BY MANUFACTURERS AFTER COVID-19 69
6.3 IMPACT ON PRICE 69
6.4 IMPACT ON DEMAND AND SUPPLY CHAIN 70
6.5 CONCLUSION 70
7 NORTH AMERICA PROBE CARD MARKET, BY PROBE TYPE 71
7.1 OVERVIEW 72
7.2 ADVANCED PROBE CARD 73
7.2.1 MEMS SP 74
7.2.2 VERTICAL PROBE 74
7.2.3 U-PROBE 74
7.2.4 SP-PROBE 74
7.2.5 OTHERS 74
7.3 STANDARD PROBE CARD 74
8 NORTH AMERICA PROBE CARD MARKET, BY MANUFACTURING TECHNOLOGY TYPE 75
8.1 OVERVIEW 76
8.2 MEMS 77
8.3 VERTICAL 77
8.4 CANTILEVER 78
8.5 EPOXY 79
8.6 BLADE 79
8.7 OTHERS 80
9 NORTH AMERICA PROBE CARD MARKET, BY WAFER SIZE 81
9.1 OVERVIEW 82
9.2 MORE THAN 12 INCHES 83
9.3 LESS THAN 12 INCHES 83
10 NORTH AMERICA PROBE CARD MARKET, BY HEAD SIZE 85
10.1 OVERVIEW 86
10.2 MORE THAN 40MM X 40MM 87
10.3 LESS THAN 40MM X 40MM 87
11 NORTH AMERICA PROBE CARD MARKET, BY TEST 89
11.1 OVERVIEW 90
11.2 DC TEST 91
11.3 FUNCTIONAL TEST 91
11.4 AC TEST 92
12 NORTH AMERICA PROBE CARD MARKET, BY MATERIAL 93
12.1 OVERVIEW 94
12.2 TUNGSTEN 95
12.3 COPPER CLAD LAMINATED (CCL) 95
12.4 ALUMINUM 96
12.5 OTHERS 96
13 NORTH AMERICA PROBE CARD MARKET, BY APPLICATION 98
13.1 OVERVIEW 99
13.2 WLCSP 100
13.3 SIP 100
13.4 MIXED SIGNAL FLIP CHIP 101
13.5 ANALOG 102
14 NORTH AMERICA PROBE CARD MARKET, BY BEAM SIZE 103
14.1 OVERVIEW 104
14.2 MORE THAN 1.5 MIL 105
14.3 LESS THAN 1.5 MIL 105
15 NORTH AMERICA PROBE CARD MARKET, BY END-USE 107
15.1 OVERVIEW 108
15.2 FOUNDRY 109
15.2.1 ADVANCED PROBE CARD 110
15.2.2 STANDARD PROBE CARD 110
15.3 PARAMETRIC 110
15.3.1 ADVANCED PROBE CARD 111
15.3.2 STANDARD PROBE CARD 111
15.4 LOGIC AND MEMORY DEVICE 111
15.4.1 ADVANCED PROBE CARD 112
15.4.2 STANDARD PROBE CARD 112
15.5 DRAM 112
15.5.1 ADVANCED PROBE CARD 113
15.5.2 STANDARD PROBE CARD 113
15.6 CMOS IMAGE SENSOR (CIS) 113
15.6.1 ADVANCED PROBE CARD 114
15.6.2 STANDARD PROBE CARD 114
15.7 FLASH 114
15.7.1 ADVANCED PROBE CARD 115
15.7.2 STANDARD PROBE CARD 115
15.8 OTHERS 115
16 NORTH AMERICA PROBE CARD MARKET, BY REGION 116
16.1 NORTH AMERICA 117
16.1.1 U.S. 128
16.1.2 CANADA 132
16.1.3 MEXICO 136
17 NORTH AMERICA PROBE CARD MARKET: COMPANY LANDSCAPE 140
17.1 COMPANY SHARE ANALYSIS: NORTH AMERICA 140
18 SWOT ANALYSIS 141
19 COMPANY PROFILE 142
19.1 FORMFACTOR 142
19.1.1 COMPANY SNAPSHOT 142
19.1.2 REVENUE ANALYSIS 142
19.1.3 COMPANY SHARE ANALYSIS 143
19.1.4 PRODUCT PORTFOLIO 143
19.1.5 RECENT DEVELOPMENTS 144
19.2 TECHNOPROBE S.P.A. 145
19.2.1 COMPANY SNAPSHOT 145
19.2.2 COMPANY SHARE ANALYSIS 145
19.2.3 PRODUCT PORTFOLIO 145
19.2.4 RECENT DEVELOPMENT 146
19.3 MICRONICS JAPAN CO., LTD. 147
19.3.1 COMPANY SNAPSHOT 147
19.3.2 REVENUE ANALYSIS 147
19.3.3 COMPANY SHARE ANALYSIS 148
19.3.4 PRODUCT PORTFOLIO 148
19.3.5 RECENT DEVELOPMENT 148
19.4 MPI CORPORATION 149
19.4.1 COMPANY SNAPSHOT 149
19.4.2 REVENUE ANALYSIS 149
19.4.3 COMPANY SHARE ANALYSIUS 150
19.4.4 PRODUCT PORTFOLIO 150
19.4.5 RECENT DEVELOPMENTS 150
19.5 CHUNGHWA PRECISION TEST TECH.CO. LTD 151
19.5.1 COMPANY SNAPSHOT 151
19.5.2 REVENUE ANALYSIS 151
19.5.3 COMPANY SHARE ANALYSIS 152
19.5.4 PRODUCT PORTFOLIO 152
19.5.5 RECENT DEVELOPMENT 152
19.6 FEINMETALL GMBH 153
19.6.1 COMPANY SNAPSHOT 153
19.6.2 PRODUCT PORTFOLIO 153
19.6.3 RECENT DEVELOPMENTS 154
19.7 HTT HIGH TECH TRADE GMBH 155
19.7.1 COMPANY SNAPSHOT 155
19.7.2 PRODUCT PORTFOLIO 155
19.7.3 RECENT DEVELOPMENTS 157
19.8 KOREA INSTRUMENT CO., LTD 158
19.8.1 COMPANY SNAPSHOT 158
19.8.2 PRODUCT PORTFOLIO 158
19.8.3 RECENT DEVELOPMENT 158
19.9 JAPAN ELECTRONIC MATERIALS CORPORATION 159
19.9.1 COMPANY SNAPSHOT 159
19.9.2 REVENUE ANALYSIS 159
19.9.3 PRODUCT PORTFOLIO 160
19.9.4 RECENT DEVELOPMENT 160
19.10 MICROFRIEND 161
19.10.1 COMPANY SNAPSHOT 161
19.10.2 PRODUCT PORTFOLIO 161
19.10.3 RECENT DEVELOPMENT 162
19.11 ONTO INNOVATION 163
19.11.1 COMPANY SNAPSHOT 163
19.11.2 REVENUE ANALYSIS 163
19.11.3 PRODUCT PORTFOLIO 164
19.11.4 RECENT DEVELOPMENTS 164
19.12 SV PROBE 165
19.12.1 COMPANY SNAPSHOT 165
19.12.2 PRODUCT PORTFOLIO 165
19.12.3 RECENT DEVELOPMENT 165
19.13 STAR TECHNOLOGIES INC. 166
19.13.1 COMPANY SNAPSHOT 166
19.13.2 PRODUCT PORTFOLIO 166
19.13.3 RECENT DEVELOPMENTS 167
19.14 RIKA DENSHI CO., LTD. 168
19.14.1 COMPANY SNAPSHOT 168
19.14.2 PRODUCT PORTFOLIO 168
19.14.3 RECENT DEVELOPMENT 168
19.15 TSE CO,. LTD. 169
19.15.1 COMPANY SNAPSHOT 169
19.15.2 REVENUE ANALYSIS 169
19.15.3 PRODUCT PORTFOLIO 170
19.15.4 RECENT DEVELOPMENT 170
19.16 TRANSLARITY 171
19.16.1 COMPANY SNAPSHOT 171
19.16.2 PRODUCT PORTFOLIO 171
19.16.3 RECENT DEVELOPMENT 171
19.17 DYNAMIC-TEST 172
19.17.1 COMPANY SNAPSHOT 172
19.17.2 PRODUCT PORTFOLIO 172
19.17.3 RECENT DEVELOPMENTS 172
19.18 WILL TECHNOLOGY 173
19.18.1 COMPANY SNAPSHOT 173
19.18.2 PRODUCT PORTFOLIO 173
19.18.3 RECENT DEVELOPMENTS 174
19.19 WENTWORTH LABS 175
19.19.1 COMPANY SNAPSHOT 175
19.19.2 PRODUCT PORTFOLIO 175
19.19.3 RECENT DEVELOPMENTS 176
19.20 WINWAY TECH. CO., LTD. 177
19.20.1 COMPANY SNAPSHOT 177
19.20.2 PRODUCT PORTFOLIO 177
19.20.3 RECENT DEVELOPMENT 177
20 QUESTIONNAIRE 178
21 RELATED REPORTS 183
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