TABLE OF CONTENTS
1 INTRODUCTION 44
1.1 OBJECTIVES OF THE STUDY 44
1.2 MARKET DEFINITION 44
1.3 OVERVIEW OF EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET 44
1.4 CURRENCY AND PRICING 46
1.5 LIMITATIONS 46
1.6 MARKETS COVERED 46
2 MARKET SEGMENTATION 51
2.1 MARKETS COVERED 51
2.2 GEOGRAPHICAL SCOPE 52
2.3 YEARS CONSIDERED FOR THE STUDY 53
2.4 DBMR TRIPOD DATA VALIDATION MODEL 54
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 57
2.6 DBMRMARKET POSITION GRID 58
2.7 VENDOR SHARE ANALYSIS 59
2.8 MULTIVARIATE MODELING 60
2.9 DESIGN TYPE TIMELINE CURVE 60
2.10 MARKET APPLICATION COVERAGE GRID 61
2.11 SECONDARY SOURCES 62
2.12 ASSUMPTIONS 62
3 EXECUTIVE SUMMARY 63
4 PREMIUM INSIGHTS 65
5 MARKET OVERVIEW 67
5.1 DRIVERS 69
5.1.1 GROWING DEMAND FOR SMARTPHONES AND TABLETS 69
5.1.2 INCREASE IN DEMAND FROM SMART CONSUMER DEVICES 70
5.1.3 EMERGENCE OF ASIC DRIVEN IOT DEVICES 70
5.1.4 RISE IN DEMAND FOR MINIATURIZED ELECTRONICS DEVICE 71
5.2 RESTRAINTS 71
5.2.1 HIGH COST ASSOCIATED WITH MANUFACTURING CUSTOMIZED CIRCUITS 71
5.2.2 ASICS VULNERABILITY TOWARDS SECURITY ATTACKS/CYBER ATTACKS 72
5.3 OPPORTUNITIES 73
5.3.1 UTILIZING ASIC TECHNOLOGIES FOR POWERING AI 73
5.3.2 UPSURGE IN ADOPTION OF MECHATRONICS FOR AUTOMOTIVE APPLICATIONS 74
5.3.3 RISE IN DEPLOYMENT OF DATA CENTERS AND HIGH-PERFORMANCE COMPUTING 75
5.3.4 GROW IN PARTNERSHIP, ACQUISITIONS, AND MERGERS FOR ASIC 76
5.4 CHALLENGES 77
5.4.1 FUNCTIONAL RELIABILITY ISSUES FACED IN ASIA 77
5.4.2 COMPLEXITY INVOLVED IN DESIGNING AND FABRICATION OF APPLICATION SPECIFIC CIRCUITS 77
6 IMPACT OF COVID-19 PANDEMIC ON EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET 79
6.1 AFTERMATH OF COVID-19 AND GOVERNMENT INITIATIVES TO BOOST THE MARKET 79
6.2 STRATEGIC DECISIONS FOR MANUFACTURERS AFTER COVID-19 TO GAIN COMPETITIVE MARKET SHARE 80
6.3 IMPACT ON DEMAND 81
6.4 IMPACT ON PRICE 81
6.5 IMPACT ON SUPPLY CHAIN 82
6.6 CONCLUSION 82
7 EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY DESIGN TYPE 83
7.1 OVERVIEW 84
7.2 SEMI-CUSTOM 85
7.2.1 STANDARD CELL-BASED ASICS 86
7.2.2 GATE-ARRAY-BASED ASICS 86
7.2.2.1 CHANNEL LESS GATE ARRAYS 86
7.2.2.2 STRUCTURED GATE ARRAYS 86
7.2.2.3 CHANNELLED GATE ARRAYS 87
7.3 PROGRAMMABLE 87
7.3.1 FPGAS (FIELD PROGRAMMABLE GATE ARRAY) 88
7.3.1.1 BY TYPE 88
7.3.1.1.1 HIGH-END FPGAS 88
7.3.1.1.2 LOW-END FPGAS 88
7.3.1.1.3 MID-RANGE FPGAS 88
7.3.1.2 BY NODE SIZE 89
7.3.1.2.1 LESS THAN 28 NM 89
7.3.1.2.2 28-90 NM 89
7.3.1.2.3 MORE THAN 90 NM 89

7.3.1.3 BY APPLICATION 89
7.3.1.3.1 FILTERING AND COMMUNICATION 90
7.3.1.3.2 MEDICAL IMAGING 90
7.3.1.3.3 COMPUTER HARDWARE EMULATION 90
7.3.1.3.4 SOFTWARE-DEFINED RADIO 90
7.3.1.3.5 BIOINFORMATICS 91
7.3.1.3.6 DIGITAL SIGNAL PROCESSING 91
7.3.1.3.7 VOICE RECOGNITION 91
7.3.1.3.8 CRYPTOGRAPHY 91
7.3.1.3.9 INTEGRATING MULTIPLE SPLDS 91
7.3.1.3.10 ASIC PROTOTYPING 91
7.3.1.3.11 DEVICE CONTROLLERS 91
7.3.2 PLDS (PROGRAMMABLE LOGIC DEVICES) 91
7.3.2.1 BY TYPE 92
7.3.2.1.1 SIMPLE PROGRAMMABLE LOGIC DEVICE (SPLDS) 92
7.3.2.1.2 HIGH CAPACITY PROGRAMMABLE LOGIC DEVICE (HCPLDS) 92
7.4 FULL CUSTOM 92
8 EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY PROGRAMMING TECHNOLOGY 94
8.1 OVERVIEW 95
8.2 STATIC RAM 96
8.3 ANTIFUSE 97
8.4 EEPROM 97
8.5 EPROM 98
8.6 OTHERS 99
9 EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY APPLICATION 100
9.1 OVERVIEW 101
9.2 CONSUMER ELECTRONICS 102
9.2.1 SMARTPHONES AND TABLETS 103
9.2.2 WIRELESS VIRTUAL REALITY DEVICES 103
9.2.3 OTHERS 103
9.3 IT & TELECOMMUNICATION 103
9.3.1 WIRELESS COMMUNICATION 104
9.3.2 WIRED COMMUNICATION 104

9.4 DATA CENTER & COMPUTING 104
9.5 MEDICAL 105
9.5.1 IMAGING DIAGNOSTICS 106
9.5.2 WEARABLE DEVICES 106
9.5.3 OTHERS 106
9.6 INDUSTRIAL 106
9.6.1 BY SECTOR 107
9.6.1.1 MILITARY, AEROSPACE & DEFENSE 107
9.6.1.2 SATELLITE & SPACE 108
9.6.1.3 AVIATION 108
9.6.1.4 POWER GENERATION 108
9.6.1.5 OIL & GAS 108
9.6.2 BY APPLICATION 108
9.6.2.1 MACHINE VISION 108
9.6.2.2 ROBOTICS 108
9.6.2.3 INDUSTRIAL SENSOR 109
9.6.2.4 INDUSTRIAL NETWORKING 109
9.6.2.5 INDUSTRIAL MOTOR CONTROL 109
9.6.2.6 VIDEO SURVEILLANCE 109
9.7 AUTOMOTIVE 109
9.7.1 ADAS 110
9.7.2 AUTOMOTIVE INFOTAINMENT & DRIVER INFORMATION SYSTEM 110
9.8 MULTIMEDIA 110
9.8.1 COMMUNICATIONS 111
9.8.2 VIDEO PROCESSING 111
9.8.3 AUDIO 111
10 EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY REGION 112
10.1 EUROPE 113
10.1.1 GERMANY 123
10.1.2 FRANCE 129
10.1.3 U.K. 135
10.1.4 NETHERLANDS 141
10.1.5 ITALY 147
10.1.6 SPAIN 153
10.1.7 SWITZERLAND 159
10.1.8 RUSSIA 165
10.1.9 TURKEY 171
10.1.10 BELGIUM 177
10.1.11 REST OF EUROPE 183
11 EUROPE APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET: COMPANY LANDSCAPE 184
11.1 COMPANY SHARE ANALYSIS: EUROPE 184
12 SWOT ANALYSIS 185
13 COMPANY PROFILE 186
13.1 INTEL CORPORATION 186
13.1.1 COMPANY SNAPSHOT 186
13.1.2 REVENUE ANALYSIS 186
13.1.3 COMPANY SHARE ANALYSIS 187
13.1.4 PRODUCTS PORTFOLIO 187
13.1.5 RECENT DEVELOPMENTS 188
13.2 INFINEON TECHNOLOGIES AG 190
13.2.1 COMPANY SNAPSHOT 190
13.2.2 REVENUE ANALYSIS 191
13.2.3 COMPANY SHARE ANALYSIS 191
13.2.4 PRODUCTS PORTFOLIO 192
13.2.5 RECENT DEVELOPMENTS 192
13.3 ANALOG DEVICES, INC. 194
13.3.1 COMPANY SNAPHOT 194
13.3.2 REVENUE ANALYSIS 194
13.3.3 COMPANY SHARE ANALYSIS 195
13.3.4 PRODUCT PORTFOLIO 195
13.3.5 RECENT DEVELOPMENTS 197
13.4 NXP SEMICONDUCTORS 199
13.4.1 COMPANY SNAPSHOT 199
13.4.2 REVENUE ANALYSIS 199
13.4.3 COMPANY SHARE ANALYSIS 200
13.4.4 PRODUCTS PORTFOLIO 200
13.4.5 RECENT DEVELOPMENTS 201
13.5 MICROCHIP TECHNOLOGY INC. 203
13.5.1 COMPANY SNAPSHOT 203
13.5.2 REVENUE ANALYSIS 203
13.5.3 COMPANY SHARE ANALYSIS 204
13.5.4 PRODUCT PORTFOLIO 204
13.5.5 RECENT DEVELOPMENTS 205

13.6 TEXAS INSTRUMENTS INCORPORATED 207
13.6.1 COMPANY SNAPSHOT 207
13.6.2 REVENUE ANALYSIS 208
13.6.3 PRODUCT PORTFOLIO 209
13.6.4 RECENT DEVELOPMENTS 210
13.7 ACHRONIX SEMICONDUCTOR CORPORATION 212
13.7.1 COMPANY SNAPSHOT 212
13.7.2 PRODUCTS PORTFOLIO 212
13.7.3 RECENT DEVELOPMENTS 212
13.8 AVNET ASIC ISRAEL LTD. 214
13.8.1 COMPANY SNAPSHOT 214
13.8.2 PRODUCT PORTFOLIO 214
13.8.3 RECENT DEVELOPMENTS 214
13.9 COBHAM LIMITED 216
13.9.1 COMPANY SNAPSHOT 216
13.9.2 PRODUCT PORTFOLIO 216
13.9.3 RECENT DEVELOPMENTS 216
13.10 ENSILICA 218
13.10.1 COMPANY SNAPSHOT 218
13.10.2 PRODUCTS PORTFOLIO 218
13.10.3 RECENT DEVELOPMENTS 218
13.11 GOWIN SEMICONDUCTOR 220
13.11.1 COMPANY SNAPSHOT 220
13.11.2 PRODUCTS PORTFOLIO 220
13.11.3 RECENT DEVELOPMENTS 220
13.12 HONEYWELL INTERNATIONAL INC. 221
13.12.1 COMPANY SNAPHOT 221
13.12.2 REVENUE ANALYSIS 221
13.12.3 PRODUCT PORTFOLIO 222
13.12.4 RECENT DEVELOPMENTS 222
13.13 LATTICE SEMICONDUCTOR 223
13.13.1 COMPANY SNAPSHOT 223
13.13.2 REVENUE ANALYSIS 223
13.13.3 PRODUCT PORTFOLIO 224
13.13.4 RECENT DEVELOPMENTS 224
13.14 MAXIM INTEGRATED 226
13.14.1 COMPANY SNAPHOT 226
13.14.2 REVENUE ANALYSIS 226
13.14.3 PRODUCT PORTFOLIO 226
13.14.4 RECENT DEVELOPMENTS 227
13.15 MEGACHIPS CORPORATION 230
13.15.1 COMPANY SNAPSHOT 230
13.15.2 REVENUE ANALYSIS 230
13.15.3 PRODUCTS PORTFOLIO 231
13.15.4 RECENT DEVELOPMENTS 231
13.16 QUALCOMM TECHNOLOGIES, INC. 233
13.16.1 COMPANY SNAPSHOT 233
13.16.2 REVENUE ANALYSIS 233
13.16.3 PRODUCTS PORTFOLIO 234
13.16.4 RECENT DEVELOPMENTS 234
13.17 QUICKLOGIC CORPORATION 236
13.17.1 COMPANY SNAPSHOT 236
13.17.2 REVENUE ANALYSIS 236
13.17.3 PRODUCT PORTFOLIO 237
13.17.4 RECENT DEVELOPMENTS 237
13.18 RENESAS ELECTRONICS CORPORATION 239
13.18.1 COMPANY SNAPHOT 239
13.18.2 REVENUE ANALYSIS 239
13.18.3 PRODUCT PORTFOLIO 239
13.18.4 RECENT DEVELOPMENTS 240
13.19 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 242
13.19.1 COMPANY SNAPSHOT 242
13.19.2 REVENUE ANALYSIS 242
13.19.3 PRODUCTS PORTFOLIO 242
13.19.4 RECENT DEVELOPMENTS 243
13.20 SOCIONEXT INC. 244
13.20.1 COMPANY SNAPSHOT 244
13.20.2 PRODUCT PORTFOLIO 244
13.20.3 RECENT DEVELOPMENTS 244
13.21 XILINX 246
13.21.1 COMPANY SNAPSHOT 246
13.21.2 REVENUE ANALYSIS 246
13.21.3 PRODUCTS PORTFOLIO 247
13.21.4 RECENT DEVELOPMENTS 247
14 QUESTIONNAIRE 249
15 RELATED REPORTS 252

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