APAC Application Specific Integrated Circuit (ASIC) Market - Industry Trends and Forecast To 2029
- Published Date: 2022-11-22
- Report ID: 144284
- Pages: 200
-
Format:
Short Description
Asia-Pacific Application Specific Integrated Circuit (ASIC) Market, By Design Type (Full Custom, Semi-Custom, and Programmable), Programming Technology (Static Ram, Eprom, Eeprom, Antifuse, and Others), Application (Consumer Electronics, Data Center & Computing, It & Telecommunication, Medical, Multimedia, Automotive, and Industrial), Country (China, South Korea, Japan, India, Australia, Singapore, Malaysia, Indonesia, Thailand, Philippines, and Rest of Asia-Pacific) Industry Trends and Forecast to 2029
Market Definition
An application-specific integrated circuit (ASIC) is an IC chip that is tailored to a specific application rather than being designed for broad usage. An ASIC is, for example, a chip that runs in a digital voice recorder or a high-efficiency video encoder (such as AMD VCE). Application-specific standard product (ASSP) chips are a middle ground between ASICs and industry-standard integrated circuits such as the 7400 or 4000 series. As MOS integrated circuit chips, ASIC chips are generally produced using metal-oxide-semiconductor (MOS) technology. The greatest complexity (and hence usefulness) available in an ASIC has expanded from 5,000 logic gates to over 100 million as feature sizes have dropped and design tools have improved over time. Microprocessors, memory blocks such as ROM, RAM, EEPROM, flash memory, and other significant building blocks are frequently included in modern ASICs. A SoC is a common moniker for such an ASIC (system-on-chip). A hardware description language (HDL), such as Verilog or VHDL, is frequently used by designers of digital ASICs to define the functioning of ASICs.
Market Segmentation
The Asia-Pacific application-specific integrated circuit (ASIC) market is segmented into three notable segments based on the design type, programming technology, and application.
On the basis of design type, the Asia-Pacific application-specific integrated circuit (ASIC) market has been segmented into full custom, semi-custom, and programmable
On the basis of programming technology segment, the Asia-Pacific application-specific integrated circuit (ASIC) market has been segmented into static ram, EPROM, EEPROM, antifuse, and other
On the basis of application segment, the Asia-Pacific application-specific integrated circuit (ASIC) market has been segmented into consumer electronics, data center & computing, IT & telecommunication, medical, multimedia, automotive, and industrial
Market Players
Some of the major players operating in the Asia-Pacific application-specific integrated circuit (ASIC) market are:
Intel Corporation
Infineon Technologies AG
Analog Devices, Inc.
NXP Semiconductors
Microchip Technology Inc.
Texas Instruments Incorporated
Achronix Semiconductor Corporation
Avnet Asic Israel Ltd.
Cobham Limited
EnSilica
GOWIN Semiconductor
Honeywell International Inc.
Lattice Semiconductor
Maxim Integrated
MegaChips Corporation
Qualcomm Technologies, Inc.
QuickLogic Corporation
Renesas Electronics Corporation
Semiconductor Components Industries, LLC
Socionext Inc.
Xilinx
TABLE OF CONTENTS
1 INTRODUCTION 44
1.1 OBJECTIVES OF THE STUDY 44
1.2 MARKET DEFINITION 44
1.3 OVERVIEW OF ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET 44
1.4 CURRENCY AND PRICING 46
1.5 LIMITATIONS 46
1.6 MARKETS COVERED 46
2 MARKET SEGMENTATION 51
2.1 MARKETS COVERED 51
2.2 GEOGRAPHICAL SCOPE 52
2.3 YEARS CONSIDERED FOR THE STUDY 53
2.4 DBMR TRIPOD DATA VALIDATION MODEL 54
2.5 PRIMARY INTERVIEWS WITH KEY OPINION LEADERS 57
2.6 DBMRMARKET POSITION GRID 58
2.7 VENDOR SHARE ANALYSIS 59
2.8 MULTIVARIATE MODELING 60
2.9 DESIGN TYPE TIMELINE CURVE 60
2.10 MARKET APPLICATION COVERAGE GRID 61
2.11 SECONDARY SOURCES 62
2.12 ASSUMPTIONS 62
3 EXECUTIVE SUMMARY 63
4 PREMIUM INSIGHTS 65
5 MARKET OVERVIEW 67
5.1 DRIVERS 69
5.1.1 GROWING DEMAND FOR SMARTPHONES AND TABLETS 69
5.1.2 INCREASE IN DEMAND FROM SMART CONSUMER DEVICES 70
5.1.3 EMERGENCE OF ASIC DRIVEN IOT DEVICES 70
5.1.4 RISE IN DEMAND FOR MINIATURIZED ELECTRONICS DEVICE 71
5.2 RESTRAINTS 71
5.2.1 HIGH COST ASSOCIATED WITH MANUFACTURING CUSTOMIZED CIRCUITS 71
5.2.2 ASICS VULNERABILITY TOWARDS SECURITY ATTACKS/CYBER ATTACKS 72
5.3 OPPORTUNITIES 73
5.3.1 UTILIZING ASIC TECHNOLOGIES FOR POWERING AI 73
5.3.2 UPSURGE IN ADOPTION OF MECHATRONICS FOR AUTOMOTIVE APPLICATIONS 74
5.3.3 RISE IN DEPLOYMENT OF DATA CENTERS AND HIGH-PERFORMANCE COMPUTING 75
5.3.4 GROW IN PARTNERSHIP, ACQUISITIONS, AND MERGERS FOR ASIC 76
5.4 CHALLENGES 77
5.4.1 FUNCTIONAL RELIABILITY ISSUES FACED IN ASIA 77
5.4.2 COMPLEXITY INVOLVED IN DESIGNING AND FABRICATION OF APPLICATION SPECIFIC CIRCUITS 77
6 IMPACT OF COVID-19 PANDEMIC ON ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET 79
6.1 AFTERMATH OF COVID-19 AND GOVERNMENT INITIATIVES TO BOOST THE MARKET 79
6.2 STRATEGIC DECISIONS FOR MANUFACTURERS AFTER COVID-19 TO GAIN COMPETITIVE MARKET SHARE 80
6.3 IMPACT ON DEMAND 81
6.4 IMPACT ON PRICE 81
6.5 IMPACT ON SUPPLY CHAIN 82
6.6 CONCLUSION 82
7 ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY DESIGN TYPE 83
7.1 OVERVIEW 84
7.2 SEMI-CUSTOM 85
7.2.1 STANDARD CELL-BASED ASICS 86
7.2.2 GATE-ARRAY-BASED ASICS 86
7.2.2.1 CHANNEL LESS GATE ARRAYS 86
7.2.2.2 STRUCTURED GATE ARRAYS 86
7.2.2.3 CHANNELLED GATE ARRAYS 87
7.3 PROGRAMMABLE 87
7.3.1 FPGAS (FIELD PROGRAMMABLE GATE ARRAY) 88
7.3.1.1 BY TYPE 88
7.3.1.1.1 HIGH-END FPGAS 88
7.3.1.1.2 LOW-END FPGAS 88
7.3.1.1.3 MID-RANGE FPGAS 88
7.3.1.2 BY NODE SIZE 89
7.3.1.2.1 LESS THAN 28 NM 89
7.3.1.2.2 28-90 NM 89
7.3.1.2.3 MORE THAN 90 NM 89
7.3.1.3 BY APPLICATION 89
7.3.1.3.1 FILTERING AND COMMUNICATION 90
7.3.1.3.2 MEDICAL IMAGING 90
7.3.1.3.3 COMPUTER HARDWARE EMULATION 90
7.3.1.3.4 SOFTWARE-DEFINED RADIO 90
7.3.1.3.5 BIOINFORMATICS 91
7.3.1.3.6 DIGITAL SIGNAL PROCESSING 91
7.3.1.3.7 VOICE RECOGNITION 91
7.3.1.3.8 CRYPTOGRAPHY 91
7.3.1.3.9 INTEGRATING MULTIPLE SPLDS 91
7.3.1.3.10 ASIC PROTOTYPING 91
7.3.1.3.11 DEVICE CONTROLLERS 91
7.3.2 PLDS (PROGRAMMABLE LOGIC DEVICES) 91
7.3.2.1 BY TYPE 92
7.3.2.1.1 SIMPLE PROGRAMMABLE LOGIC DEVICE (SPLDS) 92
7.3.2.1.2 HIGH CAPACITY PROGRAMMABLE LOGIC DEVICE (HCPLDS) 92
7.4 FULL CUSTOM 92
8 ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY PROGRAMMING TECHNOLOGY 94
8.1 OVERVIEW 95
8.2 STATIC RAM 96
8.3 ANTIFUSE 97
8.4 EEPROM 97
8.5 EPROM 98
8.6 OTHERS 99
9 ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY APPLICATION 100
9.1 OVERVIEW 101
9.2 CONSUMER ELECTRONICS 102
9.2.1 SMARTPHONES AND TABLETS 103
9.2.2 WIRELESS VIRTUAL REALITY DEVICES 103
9.2.3 OTHERS 103
9.3 IT & TELECOMMUNICATION 103
9.3.1 WIRELESS COMMUNICATION 104
9.3.2 WIRED COMMUNICATION 104
9.4 DATA CENTER & COMPUTING 104
9.5 MEDICAL 105
9.5.1 IMAGING DIAGNOSTICS 106
9.5.2 WEARABLE DEVICES 106
9.5.3 OTHERS 106
9.6 INDUSTRIAL 106
9.6.1 BY SECTOR 107
9.6.1.1 MILITARY, AEROSPACE & DEFENSE 107
9.6.1.2 SATELLITE & SPACE 108
9.6.1.3 AVIATION 108
9.6.1.4 POWER GENERATION 108
9.6.1.5 OIL & GAS 108
9.6.2 BY APPLICATION 108
9.6.2.1 MACHINE VISION 108
9.6.2.2 ROBOTICS 108
9.6.2.3 INDUSTRIAL SENSOR 109
9.6.2.4 INDUSTRIAL NETWORKING 109
9.6.2.5 INDUSTRIAL MOTOR CONTROL 109
9.6.2.6 VIDEO SURVEILLANCE 109
9.7 AUTOMOTIVE 109
9.7.1 ADAS 110
9.7.2 AUTOMOTIVE INFOTAINMENT & DRIVER INFORMATION SYSTEM 110
9.8 MULTIMEDIA 110
9.8.1 COMMUNICATIONS 111
9.8.2 VIDEO PROCESSING 111
9.8.3 AUDIO 111
10 ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET, BY REGION 112
10.1 ASIA-PACIFIC 113
10.1.1 CHINA 122
10.1.2 JAPAN 127
10.1.3 SOUTH KOREA 132
10.1.4 INDIA 137
10.1.5 AUSTRALIA 142
10.1.6 SINGAPORE 147
10.1.7 THAILAND 152
10.1.8 INDONESIA 157
10.1.9 MALAYSIA 162
10.1.10 PHILIPPINES 167
10.1.11 REST OF ASIA-PACIFIC 172
11 ASIA PACIFIC APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) MARKET: COMPANY LANDSCAPE 173
11.1 COMPANY SHARE ANALYSIS: ASIA PACIFIC 173
12 SWOT ANALYSIS 174
13 COMPANY PROFILE 175
13.1 INTEL CORPORATION 175
13.1.1 COMPANY SNAPSHOT 175
13.1.2 REVENUE ANALYSIS 175
13.1.3 COMPANY SHARE ANALYSIS 176
13.1.4 PRODUCTS PORTFOLIO 176
13.1.5 RECENT DEVELOPMENTS 177
13.2 INFINEON TECHNOLOGIES AG 179
13.2.1 COMPANY SNAPSHOT 179
13.2.2 REVENUE ANALYSIS 180
13.2.3 COMPANY SHARE ANALYSIS 180
13.2.4 PRODUCTS PORTFOLIO 181
13.2.5 RECENT DEVELOPMENTS 181
13.3 ANALOG DEVICES, INC. 183
13.3.1 COMPANY SNAPHOT 183
13.3.2 REVENUE ANALYSIS 183
13.3.3 COMPANY SHARE ANALYSIS 184
13.3.4 PRODUCT PORTFOLIO 184
13.3.5 RECENT DEVELOPMENTS 186
13.4 NXP SEMICONDUCTORS 188
13.4.1 COMPANY SNAPSHOT 188
13.4.2 REVENUE ANALYSIS 188
13.4.3 COMPANY SHARE ANALYSIS 189
13.4.4 PRODUCTS PORTFOLIO 189
13.4.5 RECENT DEVELOPMENTS 190
13.5 MICROCHIP TECHNOLOGY INC. 192
13.5.1 COMPANY SNAPSHOT 192
13.5.2 REVENUE ANALYSIS 192
13.5.3 COMPANY SHARE ANALYSIS 193
13.5.4 PRODUCT PORTFOLIO 193
13.5.5 RECENT DEVELOPMENTS 194
13.6 TEXAS INSTRUMENTS INCORPORATED 196
13.6.1 COMPANY SNAPSHOT 196
13.6.2 REVENUE ANALYSIS 197
13.6.3 PRODUCT PORTFOLIO 198
13.6.4 RECENT DEVELOPMENTS 199
13.7 ACHRONIX SEMICONDUCTOR CORPORATION 201
13.7.1 COMPANY SNAPSHOT 201
13.7.2 PRODUCTS PORTFOLIO 201
13.7.3 RECENT DEVELOPMENTS 201
13.8 AVNET ASIC ISRAEL LTD. 203
13.8.1 COMPANY SNAPSHOT 203
13.8.2 PRODUCT PORTFOLIO 203
13.8.3 RECENT DEVELOPMENTS 203
13.9 COBHAM LIMITED 205
13.9.1 COMPANY SNAPSHOT 205
13.9.2 PRODUCT PORTFOLIO 205
13.9.3 RECENT DEVELOPMENTS 205
13.10 ENSILICA 207
13.10.1 COMPANY SNAPSHOT 207
13.10.2 PRODUCTS PORTFOLIO 207
13.10.3 RECENT DEVELOPMENTS 207
13.11 GOWIN SEMICONDUCTOR 209
13.11.1 COMPANY SNAPSHOT 209
13.11.2 PRODUCTS PORTFOLIO 209
13.11.3 RECENT DEVELOPMENTS 209
13.12 HONEYWELL INTERNATIONAL INC. 210
13.12.1 COMPANY SNAPHOT 210
13.12.2 REVENUE ANALYSIS 210
13.12.3 PRODUCT PORTFOLIO 211
13.12.4 RECENT DEVELOPMENTS 211
13.13 LATTICE SEMICONDUCTOR 212
13.13.1 COMPANY SNAPSHOT 212
13.13.2 REVENUE ANALYSIS 212
13.13.3 PRODUCT PORTFOLIO 213
13.13.4 RECENT DEVELOPMENTS 213
13.14 MAXIM INTEGRATED 215
13.14.1 COMPANY SNAPHOT 215
13.14.2 REVENUE ANALYSIS 215
13.14.3 PRODUCT PORTFOLIO 215
13.14.4 RECENT DEVELOPMENTS 216
13.15 MEGACHIPS CORPORATION 219
13.15.1 COMPANY SNAPSHOT 219
13.15.2 REVENUE ANALYSIS 219
13.15.3 PRODUCTS PORTFOLIO 220
13.15.4 RECENT DEVELOPMENTS 220
13.16 QUALCOMM TECHNOLOGIES, INC. 222
13.16.1 COMPANY SNAPSHOT 222
13.16.2 REVENUE ANALYSIS 222
13.16.3 PRODUCTS PORTFOLIO 223
13.16.4 RECENT DEVELOPMENTS 223
13.17 QUICKLOGIC CORPORATION 225
13.17.1 COMPANY SNAPSHOT 225
13.17.2 REVENUE ANALYSIS 225
13.17.3 PRODUCT PORTFOLIO 226
13.17.4 RECENT DEVELOPMENTS 226
13.18 RENESAS ELECTRONICS CORPORATION 228
13.18.1 COMPANY SNAPHOT 228
13.18.2 REVENUE ANALYSIS 228
13.18.3 PRODUCT PORTFOLIO 228
13.18.4 RECENT DEVELOPMENTS 229
13.19 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 231
13.19.1 COMPANY SNAPSHOT 231
13.19.2 REVENUE ANALYSIS 231
13.19.3 PRODUCTS PORTFOLIO 231
13.19.4 RECENT DEVELOPMENTS 232
13.20 SOCIONEXT INC. 233
13.20.1 COMPANY SNAPSHOT 233
13.20.2 PRODUCT PORTFOLIO 233
13.20.3 RECENT DEVELOPMENTS 233
13.21 XILINX 235
13.21.1 COMPANY SNAPSHOT 235
13.21.2 REVENUE ANALYSIS 235
13.21.3 PRODUCTS PORTFOLIO 236
13.21.4 RECENT DEVELOPMENTS 236
14 QUESTIONNAIRE 238
15 RELATED REPORTS 241
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